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Despite the cost side, the price of FPC flexible circuit board assembly is declining and becomes close to conventional rigid circuits. The main reason is the introduction of newer materials, improved production processes and structural changes. The current structure makes the product more thermally stable and there is very little material mismatch. Some newer materials have thinner copper layers that allow for more precise lines, making the components lighter and more suitable for small spaces. The flexible circuit after removing some adhesive has flame retardant properties. This will speed up the uL certification process and further reduce costs. Flexible circuit board solder masks and other surface coatings further reduce flexible assembly costs.

In the next few years, smaller, more complex and more expensive FPC flexible boards will require newer method assemblies and the need to add hybrid flexible circuits. The challenge for the flexible circuit industry is to leverage its technological advantages to keep pace with computers, telecommunications, consumer demand and an active market. In addition, flexible circuits will play an important role in lead-free operations.
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